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Core Materials · Substrates

Si-Wafers and CMP Pads are critical materials that determine chip performance and flatness in semiconductor manufacturing.

INLASER provides specialized laser equipment for processing and identifying these essential components.

Key Processes: Core Materials & Substrates

Si-Wafer Ablation & Texturing

Precision laser processing of silicon wafer surfaces maximizes the adhesion of key components.

  • Enhanced Adhesion: Texturing improves bonding for components like pellicles
  • Precision Ablation: Selectively removes surface layers with micro-beams
  • Damage-free: Non-contact processing minimizes physical stress

CMP Pad Marking

CMP Pad Identification: Marks data on pad surfaces for semiconductor process traceability.

  • Unique Identification: Marks specs and manufacturing info without material damage
  • Process Traceability: Precise data engraving for Smart Factory integration
  • Material Optimization: Prevents deformation through material-specific laser control