Performance
Equipment
INLASER supports process development and evaluation from sample testing to mass production optimization, using in-house equipment.
| Wavelength | 1068~1080 nm |
|---|---|
| Materials | Al / Steel / Metal |
| Applications | Secondary battery Terminal / Current Collector Plate |
This welding system simultaneously controls the core beam and ring beam to achieve deep penetration while suppressing spatter.
| Wavelength | 1070 nm |
|---|---|
| Materials | Stainless steel / Ni-plated steel / Metal |
| Applications | Precision seal welding |
This is a laser welding test system based on IR CW single/dual mode operation. It supports the development of welding parameters tailored to customer materials, as well as sample testing.
suspension
suspension
| Wavelength | 1080 nm |
|---|---|
| Materials | Al / Cu / Metal |
| Applications | Battery case sealing |
This high-power CW fiber laser is used to test process conditions for forming continuous weld seams on thick aluminum and copper materials.
| Wavelength | 1064 nm |
|---|---|
| Materials | Ni / Cu wire / Metal |
| Applications | Wire bonding & pin welding |
Using QCW pulses to minimize the heat-affected zone, this system verifies process conditions that reduce base material damage when joining fine wires and pins.
| Wavelength | 1070 nm |
|---|---|
| Materials | Ni / Cu / Al / Metal |
| Applications | Secondary battery tab & busbar welding |
This welding system simultaneously controls the core beam and ring beam to achieve deep penetration while suppressing spatter.
ablation
| Wavelength | 532 nm |
|---|---|
| Materials | Semiconductors / PCB |
| Applications | Fine marking, cutting & patterning |
Leveraging its short wavelength to minimize the heat-affected zone, this system verifies micro-machining conditions for precision components such as semiconductors and PCBs.
| Wavelength | 355 nm |
|---|---|
| Materials | Glass / Film / PCB |
| Applications | Ultra-precision marking & cutting |
Operating in the ultraviolet wavelength range, this system tests ultra-precision cutting and marking conditions with near-athermal (cold) processing.
gate cutting
| Wavelength | 355 nm |
|---|---|
| Materials | Wafers / Film |
| Applications | Multi-axis precision cutting & patterning |
With its multi-axis scanning configuration, this system simultaneously verifies both processing speed and machining accuracy for large-area precision patterning of wafers, films, and similar materials.
back cover
| Wavelength | 1064 nm |
|---|---|
| Materials | Metals in general |
| Applications | Logo engraving & traceability marking |
This system tests process conditions for engraving logos, specifications, and traceability information (QR / DataMatrix codes) on metal surfaces.
| Wavelength | 355 nm |
|---|---|
| Materials | FPCB, Cover-lay, FR4, Prepreg & Thin-Metals |
| Applications | Cover-lay Opening, FPCB Outline Cutting |
A UV(355nm)-based precision laser system specialized in FPCB cover-lay opening and outline cutting, featuring vision-based automatic alignment and tolerance compensation.
▶ VIDEO
- Head Office [14449] #202-701~704, Bucheon Technopark Ssangyong 3 cha, 397, Seockcheon-ro, Bucheon-si, Gyeonggi-do, Republic of Korea
- Dongtan Branch [18468] #312~313, Dongtan woominewv, 121, Dongtan-daero 23-gil, Hwaseong-si, Gyeonggi-do, Republic of Korea
- TEL +82-32-715-5690
- FAX +82-32-715-5694
- Business Registration Number 130-86-51804