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Performance

Equipment

INLASER supports process development and evaluation from sample testing to mass production optimization, using in-house equipment.

              

Cylindrical terminal
Cu Plate
WELDING
EQ.01
IR CW Single Dual Beam Mode
Wavelength
1070 nm
Materials
Ni / Cu / Al / Metal
Applications
Secondary battery tab & busbar welding

This welding system simultaneously controls the core beam and ring beam to achieve deep penetration while suppressing spatter.

             
Pouch battery tab
Cylindrical busbar
WELDING
EQ.02
IR CW Single Mode / Dual Mode
Wavelength 1070 nm
Materials Stainless steel / Ni-plated steel / Metal
Applications Precision seal welding

This is a laser welding test system based on IR CW single/dual mode operation. It supports the development of welding parameters tailored to customer materials, as well as sample testing.

Automotive
suspension
Automotive
suspension
WELDING
EQ.03
IR CW Fiber LASER
Wavelength 1080 nm
Materials Al / Cu / Metal
Applications Battery case sealing

This high-power CW fiber laser is used to test process conditions for forming continuous weld seams on thick aluminum and copper materials.

             
Needle handle
Cylindrical terminal
WELDING
EQ.04
IR QCW Multi Mode
Wavelength 1064 nm
Materials Ni / Cu wire / Metal
Applications Wire bonding & pin welding

Using QCW pulses to minimize the heat-affected zone, this system verifies process conditions that reduce base material damage when joining fine wires and pins.

             
Smartphone
back cover
Plastic molding
MARKING
EQ.05
IR PULSE FIBER LASER
Wavelength 1064 nm
Materials Metals in general
Applications Logo engraving & traceability marking

This system tests process conditions for engraving logos, specifications, and traceability information (QR / DataMatrix codes) on metal surfaces.

             
Smartphone case
Glass coating
ablation
MARKINGCUTTINGPATTERNING
EQ.06
Green DPSS LASER
Wavelength 532 nm
Materials Semiconductors / PCB
Applications Fine marking, cutting & patterning

Leveraging its short wavelength to minimize the heat-affected zone, this system verifies micro-machining conditions for precision components such as semiconductors and PCBs.

                 
Metal DataMatrix
Silicon DataMatrix
MARKINGCUTTINGPATTERNING
EQ.07
UV DPSS LASER
Wavelength 355 nm
Materials Glass / Film / PCB
Applications Ultra-precision marking & cutting

Operating in the ultraviolet wavelength range, this system tests ultra-precision cutting and marking conditions with near-athermal (cold) processing.

LCD trimming
camera spring
gate cutting
MARKINGCUTTINGPATTERNING
EQ.08
UV PULSE LASER
Wavelength 355 nm
Materials Wafers / Film
Applications Multi-axis precision cutting & patterning

With its multi-axis scanning configuration, this system simultaneously verifies both processing speed and machining accuracy for large-area precision patterning of wafers, films, and similar materials.

In-House Process
EQ.09
Auto Correction System
Wavelength N/A
Materials N/A
Applications Used in process steps during equipment manufacturing

This system measures and analyzes coordinates using a vision camera, then precisely calibrates laser coordinates based on the derived error values.

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In-House Process
EQ.10
BeamWatch System
Wavelength N/A
Materials N/A
Applications Used in process steps during equipment manufacturing

Equipped with a non-contact, real-time beam profiler, this system measures and monitors focal shift and beam quality in real time during high-power laser processing.